microPREP® L system for production-ready laser-based sample preparation microPREP® L system for production-ready laser-based sample preparation
microPREP® L system for production-ready laser-based sample preparation microPREP® L system for production-ready laser-based sample preparation Size comparison of the microPREP® L system to a Machine user. Cross section of a die stack for SEM analysis Lamella for TEM analysis. SEM image of processed Titanium Nitride on Silicon microtip arrays using the microPREP PRO FEMTO. Image courtesy of the University of Leoben. Sample for nano CT analysis. Compression pillar for micromechanical testing.

microPREP® L

The microPREP® L is your tool for laser-based sample preparation – especially when operating in a fab environment.

The primary advantages of microPREP L are its unmatched scalability in terms of sample size, high throughput and precision, and automation-ready workflows. The system is designed to support sample sizes up to whole 12-inch (300-mm) wafers and system-level boards. It delivers productivity gains for failure analysis, process development, and quality assurance in the semiconductor and electronics industries. Multiple samples can be prepared at different locations on wafers or system-level boards within a single workflow, without process restarts.

By supporting system-level preparation without cutting up the sample into smaller pieces, this platform helps preserve device integrity, thereby accelerating failure localization and analysis. These capabilities also enable failure analysis to be extended beyond the lab and into fab environments, where rapid root-cause analysis is critical to improving yield and uptime.

microPREP L can ablate metals, semiconductors, ceramics, polymers, and compound materials. It creates new vistas for material and process development and failure analysis.

The laser source is the main component of the microPREP L system. This ultrashort pulsed laser source, combined with an optimized optical setup, enables fast material removal with nanometer precision. microPREP L’s automation-ready workflows allow for seamless integration into production.

microPREP L can prepare larger samples, such as whole 12-inch (30-mm) wafers or boards, without cutting – in multiple areas in one run.

With the microPREP L laser-based sample preparation system, your fab or lab benefits from the following advantages:

  • Free-form sample preparation
  • Preparation directly on bigger samples like whole 12-inch (300-mm) wafers and system-level boards
  • Automation-ready workflows
  • Preparation in multiple sample areas in one run, without cutting or process restarts
  • Samples with micron-level precision
  • Sophisticated workflows for automated tasks
  • Reduces time-to-sample significantly
  • Lower cost per sample
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