Scientific Papers and Articles on the microPREP™ Family and Laser-Based Sample Preparation
Over the past few years, several scientific papers and articles have been published that explore laser-based specimen preparation techniques and showcase the capabilities of 3D-Micromac’s sample preparation tools from the microPREP family. This list includes our own publications as well as papers from scientists who have used the microPREP machines to accomplish their analytical objectives. Please don’t hesitate to contact us for further information.
How laser technology speeds up sample preparation processes
Content: Reporting technological advancements in laser-based sample preparation.
Published in: Microscopy & Analysis 2024/02
Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry
Focus: Sharing a new workflow for failure analysis of microelectronic devices
Published in: Proceedings of ISTFA 2021
Speeding up large-scale failure analysis of semiconductor devices by laser ablation
Focus: Semiconductor workflows for preparing a large solder ball cross-sectioning and polishing, a deep MEMS cross-sectioning and polishing, as well as removing the MEMS silicon cap and accessing underlying structures
Published in: Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020)
Efficient preparation of microtip arrays for atom probe tomography using fs-laser processing
Focus: APT coupons with microtip arrays processed via fs-laser ablation
Published in: Ultramicroscopy, Volume 246
Link: https://www.sciencedirect.com/science/article/abs/pii/S0304399122001917
Preparing TEM Specimens and Atom Probe Tips by Laser Machining
Focus: Laser-based preparation TEM lamellas (H-Bar) and multiple APT tips or pillars
Published in: Microscopy Today, Volume 27, Issue 6
Laser ablation sample preparation for atom probe tomography and transmission electron microscopy
Focus: Study of damage caused during laser-based sample preparation in pure aluminum and phosphorous doped silicon wafers
Published in: Ultramicroscopy, Volume 220