Scientific Papers and Articles on the microPREP™ Family and Laser-Based Sample Preparation

Over the past few years, several scientific papers and articles have been published that explore laser-based specimen preparation techniques and showcase the capabilities of 3D-Micromac’s sample preparation tools from the microPREP family. This list includes our own publications as well as papers from scientists who have used the microPREP machines to accomplish their analytical objectives. Please don’t hesitate to contact us for further information.

Content: Reporting technological advancements in laser-based sample preparation.

Published in: Microscopy & Analysis 2024/02


Focus: Sharing a new workflow for failure analysis of microelectronic devices

Published in: Proceedings of ISTFA 2021


Focus:  Semiconductor workflows for preparing a large solder ball cross-sectioning and polishing, a deep MEMS cross-sectioning and polishing, as well as removing the MEMS silicon cap and accessing underlying structures

Published in: Proceedings of the  IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020)


Focus: APT coupons with microtip arrays processed via fs-laser ablation

Published in: Ultramicroscopy, Volume 246


Focus: Laser-based preparation TEM lamellas (H-Bar) and multiple APT tips or pillars

Published in: Microscopy Today, Volume 27, Issue 6


Focus: Study of damage caused during laser-based sample preparation in pure aluminum and phosphorous doped silicon wafers

Published in: Ultramicroscopy, Volume 220