Preparation of electron-transparent thin specimens can be costly in terms of time and is often challenging. Materials and products are becoming more complex, and device components are getting smaller each year. On the other hand, analysis and diagnostic methods become more exacting. Lack of time and high costs for diagnostics force companies to speed up, simplify, and customize the analysis process. Ultra-short-pulsed laser-based sample preparation can speed up the process and make possible new sample geometries.
In this whitepaper you will find out:
Why laser processing is an effective method for rapidly removing significant volumes of material,
How laser micromaching can be used to prepare TEM lamellas (H-Bar) and multiple APT tips or pillars, and
How CO2 cleaning can be used for removing redeposited material
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Preparing TEM Specimens and Atom Probe Tips by Laser Machining
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