microPREP® L

The Bottleneck in Modern Failure Analysis

Mechanical polishing can induce stress and compromise the integrity of the sample. Conventional FIB milling is limited by ablation rate, sample size, operating cost, and the need for expert operators. Hybrid “laser+FIB” platforms combine functions but introduce capacity bottlenecks and particle contamination.

A Dedicated, Scalable Alternative

microPREP L is a standalone laser micromachining platform for fast, precise, and reproducible material removal—on large and complex assemblies, such as advanced semiconductor packages, printed circuit boards, and entire 12-inch (300 mm) wafers. By enabling system-level preparation without cutting the sample into pieces, microPREP L preserves device integrity and accelerates the localization of failures.

Key Benefits

Prepare multiple samples
on a single wafer or board in one workflow
Micrometer-level targeting
with real-time depth sensing
Offload bulk removal
and optimize downstream FIB/SEM tools
Automation-ready
for high throughput and repeatability

Are you interested in speeding up your time-to-sample?

Go to the microPREP® L product page!

Sample Scalability

microPREP L supports whole wafers up to 12 inches and large board-level devices for both lab and fab environments. Designed with a roadmap for even larger formats.

Automated Workflows

High-throughput, repeatable operation with minimal operator intervention.

Selective Laser Ablation

Localized, non-destructive material removal that protects regions of interest.

Multi-Sample Workflow Efficiency

Prepare multiple sites on the same wafer or board in a single workflow without restarts.

In-Situ Process Monitoring

Real-time depth sensing and ablation control for high accuracy, less rework, and improved yield.

In-Situ Process Monitoring

Real-time depth sensing and ablation control for high accuracy, less rework, and improved yield.

Customizable Recipes

Flexible across materials, stacks, and geometries.

Clean Specimens

For good results in terms of specimen cleanliness and an optimal start for post-processing steps, microPREP PRO provides a compressed air system.

Where microPREP L Fits

Failure Analysis: Rapid, damage-free access to regions of interest across wafer- and system-level devices.
Process Development: Fast iteration during technology bring-up and ramp.
Quality Assurance: Reproducible preparation that supports high sampling rates.
Lab-to-Fab: Scalable workflows that extend advanced sample prep into production environments.

Typical Workflow

Define sites across wafer or board
Load recipe and depth targets
Selective laser ablation with real-time monitoring
Optional clean-up
Transfer to FIB/SEM for final thinning or cross-sectioning

Technical Highlights

Supported sample sizes: up to 12-inch (300 mm) wafers and large system-level boards
Micrometer-level targeting and non-destructive removal
Real-time depth sensing and ablation control
Automation-ready operation and multi-site workflows
Designed for integration with FIB/SEM finishing steps

Ready to scale failure analysis from die to full wafers and boards?

Get in touch!

FAQ

What sample sizes does microPREP L support?

Whole 12-inch (300 mm) wafers and large system-level boards.

How does it reduce time-to-sample versus FIB?

By offloading bulk removal to selective laser ablation and preparing multiple sites in one workflow.

Is the process destructive?

The system uses selective, localized laser ablation designed to avoid damaging regions of interest.

Can it work in fab environments?

Yes. Automation-ready workflows and large-format support enable deployment beyond the lab.

How does in-situ monitoring help?

Real-time depth sensing and ablation control improve accuracy and reduce rework.

Does it replace FIB/SEM?

No. It complements FIB/SEM by accelerating bulk removal so precision finishing is faster.

Can recipes be customized?

Yes. Recipes can be tailored to materials, stacks, and geometries.

What throughput can I expect?

Internal benchmarks show up to 32 cross-section samples per eight-hour shift by one operator. Actual results depend on sample and recipe.